Thermal Potting Compound 2.0 W/m·K | HN-8820 | For Power Modules & Transformers
Product Overview for Thermally Conductive Potting Compound:
This thermally conductive potting compound (2.0 W/m·K) is designed for high-power modules and transformers, providing electrical isolation and heat dissipation in one material.
Performance Highlights for Thermally Conductive Potting Compound
•Effective heat transfer
•Electrical insulation
•Easy 1:1 mixing
•Long-term stability
Technical Parameters for Thermally Conductive Potting Compound:
• Viscosity: 5000–8000 cP
•Density: 2.36 g/cm³
•Pot Life: 1–2 hrs
•Cure: 2–4 hrs @ 25°C
Applications for Thermally Conductive Potting Compound:
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High-power LED modules
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Transformer potting
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Inverter systems
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Charging stations
Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.
Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.
Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.
FAQ for Thermally Conductive Potting Compound:
Q: Can I use it for high-voltage transformers?
A: Yes, it has high dielectric strength.
Q: Does it require special equipment?
A: Only mixing and degassing tools.
Q: Is it suitable for potting large components?
A: Yes, due to good flow.
Q: What is the service temperature?
A: -40°C to 150°C.
Q: Is it certified?
A: UL94 V-0 recognized.
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Thermal Potting Compound 2.0 W/M·K | HN-8820 | For Power Modules & Transformers Images
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